Update actions products

doc/gen/README.md

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+# PCB
+
+Board size: 80.77x60.45 mm (3.18x2.38 inches)
+
+- This is the size of the rectangle that contains the board
+- Thickness: 1.6 mm (63 mils)
+- Material: FR4
+- Finish: HAL
+- Layers: 2
+- Copper thickness: 35 µm
+
+Solder mask: TOP / BOTTOM
+
+- Color: Green
+
+Silk screen: TOP / BOTTOM
+
+- Color: White
+
+
+# Important sizes
+
+Clearance: 0.2 mm (8 mils)
+
+Track width: 0.18 mm (7 mils)
+
+- By design rules: 0.2 mm (8 mils)
+
+Drill: 0.3 mm (12 mils)
+
+- Vias: 0.6 mm (24 mils) [Design: 0.4 mm (16 mils)]
+- Pads: 0.3 mm (12 mils)
+- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
+
+Via: 0.89/0.5 mm (35/20 mils)
+
+- By design rules: 0.4/0.3 mm (16/12 mils)
+- Micro via: yes [0.2/0.1 mm (8/4 mils)]
+- Buried/blind via: yes
+- Total: 267 (thru: 267 buried/blind: 0 micro: 0)
+
+Outer Annular Ring: 0.1 mm (4 mils)
+
+- By design rules: 0.1 mm (4 mils)
+
+Eurocircuits class: 6D
+- Using min drill 0.25 mm for an OAR of 0.13 mm
+
+
+# General stats
+
+Components count: (SMD/THT)
+
+- Top: 25/15 (SMD + THT)
+- Bottom: 52/1 (SMD + THT)
+
+Defined tracks:
+
+
+Used tracks:
+
+- 0.18 mm (7 mils) (279) defined: no
+- 0.2 mm (8 mils) (7) defined: no
+- 0.25 mm (10 mils) (15) defined: no
+- 0.25 mm (10 mils) (5) defined: no
+- 0.3 mm (12 mils) (104) defined: no
+- 0.4 mm (16 mils) (379) defined: no
+- 0.5 mm (20 mils) (88) defined: no
+- 0.6 mm (24 mils) (88) defined: no
+- 0.89 mm (35 mils) (40) defined: no
+
+Defined vias:
+
+
+Used vias:
+
+- 0.89/0.5 mm (35/20 mils) (Count: 267, Aspect: 1.8 A) defined: no
+
+Holes (excluding vias):
+
+- 0.2 mm (8 mils) (4)
+- 0.65 mm (26 mils) (4)
+- 0.89 mm (35 mils) (26)
+- 1.3 mm (51 mils) (8)
+- 1.6 mm (63 mils) (4)
+- 2.7 mm (106 mils) (6)
+- 3.0 mm (118 mils) (4)
+
+Oval holes:
+
+- 0.5x0.9 mm (20x35 mils) (4)
+- 0.6x1.4 mm (24x55 mils) (4)
+- 0.6x1.7 mm (24x67 mils) (4)
+
+Drill tools (including vias and computing adjusts and rounding):
+
+- 0.3 mm (12 mils) (4)
+- 0.6 mm (24 mils) (271)
+- 0.65 mm (26 mils) (4)
+- 0.7 mm (28 mils) (8)
+- 1.0 mm (39 mils) (26)
+- 1.4 mm (55 mils) (8)
+- 1.7 mm (67 mils) (4)
+- 2.7 mm (106 mils) (6)
+- 3.1 mm (122 mils) (4)
+
+Solder paste stats:
+
+Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³
+and 1.0 g/cm³ for the flux. This paste has an specific gravity of  4.15 g/cm³.
+
+The stencil thickness is  0.12 mm.
+
+| Side   | Pads with paste | Area [mm²] | Paste [g] |
+|--------|-----------------|------------|-----------|
+| Top    |              75 |     109.95 |      0.55 |
+| Bottom |             174 |     133.40 |      0.66 |
+| Total  |             249 |     243.35 |      1.21 |
+
+Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed.
+
+
+

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