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fixed CC1101 module footprint
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stan23 committed Nov 14, 2019
1 parent 1bd7978 commit 86b4114
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Showing 2 changed files with 12 additions and 12 deletions.
12 changes: 6 additions & 6 deletions libraries/myRadioModules.pretty/CC1101_SMD_THT.kicad_mod
Original file line number Diff line number Diff line change
Expand Up @@ -23,12 +23,12 @@
(pad 7 thru_hole circle (at 5 0) (size 1.27 1.27) (drill 0.762) (layers *.Cu *.Mask))
(pad 8 thru_hole circle (at 7 0) (size 1.27 1.27) (drill 0.762) (layers *.Cu *.Mask))
(pad "" np_thru_hole circle (at 1.016 -17.526) (size 3.3 3.3) (drill 3) (layers *.Cu *.Mask))
(pad 1 smd rect (at -6.985 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 2 smd rect (at -5.0165 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 1 smd rect (at -7 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 2 smd rect (at -5 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 3 smd rect (at -3 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 4 smd rect (at -1.016 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 5 smd rect (at 1.016 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 4 smd rect (at -1 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 5 smd rect (at 1 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 6 smd rect (at 3 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 7 smd rect (at 5.0165 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 8 smd rect (at 6.985 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 7 smd rect (at 5 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 8 smd rect (at 7 1) (size 1.2 2) (layers F.Cu F.Mask))
)
12 changes: 6 additions & 6 deletions libraries/myRadioModules.pretty/CC1101_SMD_THT_Antenna.kicad_mod
Original file line number Diff line number Diff line change
Expand Up @@ -22,14 +22,14 @@
(pad 6 thru_hole circle (at 3 0) (size 1.27 1.27) (drill 0.762) (layers *.Cu *.Mask))
(pad 7 thru_hole circle (at 5 0) (size 1.27 1.27) (drill 0.762) (layers *.Cu *.Mask))
(pad 8 thru_hole circle (at 7 0) (size 1.27 1.27) (drill 0.762) (layers *.Cu *.Mask))
(pad 1 smd rect (at -6.985 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 2 smd rect (at -5.0165 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 1 smd rect (at -7 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 2 smd rect (at -5 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 3 smd rect (at -3 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 4 smd rect (at -1.016 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 5 smd rect (at 1.016 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 4 smd rect (at -1 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 5 smd rect (at 1 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 6 smd rect (at 3 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 7 smd rect (at 5.0165 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 8 smd rect (at 6.985 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 7 smd rect (at 5 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 8 smd rect (at 7 1) (size 1.2 2) (layers F.Cu F.Mask))
(pad 10 thru_hole circle (at -1.25 -18) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 9 thru_hole circle (at 1 -18) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 11 thru_hole circle (at 3.25 -18) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
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